The mounting design of LGA 775 motherboards take heat sink and fan weight into account.
Motherboards that are compatible with the LGA 775 processor socket are designed to mount Intel processors from the Celeron, Pentium 4, Core 2 and Xeon processor families. The LGA 775 socket supports processors rated from 1.8 to 3.8 gigahertz with front side bus speeds between 533 and 1600 megahertz.
Dimensions
The LGA 775 motherboard socket has a total of 775 pins arranged in a 30-by-33 grid pattern with a 15-by-14 section left empty in the middle of the mount. This arrangement of contacts also leaves one corner two pairs of contacts on the side of the contact empty. The physical mount for the 775 socket measures 1.48 inches square.
Socket Attachment
The LGA 775 socket is attached to the motherboard using contact solder balls designed to meet load specifications. The LGA 775 specifications encompass the expected mechanical shocks and vibration that the socket is expected to withstand while a processor, heat sink and fan are attached and operational.
Socket Material
The plastic housing of the socket is a thermoplastic material with a UL 94 V-0 flame rating and heat rating that can maintain its structural integrity for at least 40 seconds at 260 degrees. The socket material is also tested for its ability to resist thermal expansion within certain limits when it is heated by the processor.
Mounting Force
The LGA 775 socket includes an actuating lever designed to push the processor into place on the processor socket. This lever has a maximum vertical pound-force of 8.6 and a a maximum lateral pound-force of 2.3.
Tags: heat sink, processor socket