Clean the motherboard thoroughly when finished; any debris may damage the delicate components.
Introduced by IBM in the 1960s, a flip chip is a computer chip that is attached to a motherboard with solder instead of tiny wires. Underfill is a polymer placed under a flip chip to fill the space between the chip and the motherboard. It protects the active surface of the flip chip from being damaged. If a flip chip is removed from the motherboard, the underfill needs to be removed as well. Underfill is ground away with a grinding tool. Exercise caution and avoid damaging the motherboard.
Instructions
1. Touch the tip of a soldering iron to the solder holding the chip to the motherboard. Melt the solder to liquefy it.
2. Vacuum the melted solder with a solder vacuum or solder sucker.
3. Grab the chip with tweezers and pull it straight up to remove it from the motherboard.
4. Remove the underfill from the motherboard with a dremel tool equipped with a grinding attachment. Gently touch the grinding attachment to the surface of the motherboard to grind away the underfill little by little. Do not press down onto the underfill with too much pressure or you will grind and damage the motherboard.
5. Blow away the sediment with a keyboard air duster or pressurized aerosol spray can.
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